Clinching Process Monitoring

The process monitoring CEP 400T has been specifically designed for the TOX®-Joining process. The CEP 400T helps you to monitor and document all quality parameters related to the TOX®-Clinching process.

Force sensors measure the press force during the joining process. A position sensor monitors the cylinder travel to achieve the quality control dimension "X". Once the position sensor signals that the dimension "X" has been reached (bottom end position), then the measured force values are compared to the nominal values. The TOX®-Joint is OK when the measured force value falls within the preset force range. The resulting bottom thickness "X" is proportional to the shear and pull strengths of the joint, as long as the joining parameters and expected tool life are observed and maintained.

• Color touchscreen
• Versions with 1 / 2 / 4 / 8 / 12 channels
• Individual evaluation with 1-/2 channel versions
• Real names for program memory, up to 40 characters
• 64 sensor configurations per channel
• 4 password levels: operator, setup technician, integrator, manufacturer
• 16 digital inputs and 8 digital outputs
• Status indicator menu of digital I/O ports
• Stores up to 1000 values with time stamp
• Includes TOX®softWare for parameterization and data recording
• Choice of panel mount unit or wall mount unit IP54
• Ethernet interface
• Provides important information about the process sequence
• Special monitoring by means of window technology for clinching processes
• Individual measuring programs available
• Storage of final values

• Field bus interfaces of all common bus systems*
• Process sequence control for TOX®-Clinching Processes
• Service modules such as
  • Remote maintenance
  • Test control unit to check measuring chain
• Analog output 0 – 10 V
• Evaluation unit for bench top presses TOX®-FinePress
• Display of control dimension X (absolute value)

*With field bus connection, individual evaluation IO/NIO and end values are displayed, independent of the number of measuring channels in the device.